Base frequency 3.3GHz
Max boost frequency 5.3GHz
Core Rocket Lake-S
Manufacturing process 14nm
Number of cores 10 x physical (20 threads)
IGP Intel Iris Xe Graphics 32
Simultaneous Multithreading Yes
Cache 20MB L3, 10 x 512KB L2
Memory controller Dual-channel DDR4, up to 3200MHz
Packaging LGA1200
Thermal design power (TDP) 125W
Features Thermal Velocity Boost, Turbo Boost Max Technology 3, Turbo Boost 2, FMA3, F16C, SHA, BMI / BMI1 + BMI2, AVX-512, AVX2, AVX, AES, SSE4a, SSE4, SSSE3, SSE3, SSE2, SSE, MMX…